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Optical & Imaging System
Camera Type: 4 or 8 or 12 Mpix camera (factory setting)
Optical Resolution: 6 μm or 8 μm or 10 μm or 15 μm (factory setting)
3D Projection: Dual Digital Fringe Projectors
Inspection Functions
Defects Detected: Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste & Bridging
Measurement: Height, area, volume and offset
Mechanical Stage
XY-axis ball screw with DSP-based motion controller
XY Resolution: 1 μm (up to 0.5 μm with optional linear encoder)
Z Resolution: 1 μm (up to 0.5 μm with optional linear encoder)
Inspection Speed
Camera Resolution/ Imaging Speed FOV/sec
4 Mpix/3
8 Mpix/2
12 Mpix/2
PCB and Conveyor System
Min. PCB Size: 50 x 50 mm (1.97 x 1.97 in)
Max. PCB Size: 510x460mm(20.1x18.1 in)
PCB Thickness: 0.6 - 5 mm (0.02 - 0.20 in)
PCB Transport Height: 880 - 920 mm (34.6 - 36.2 in)
Max. PCB Weight: 3 kg (6.61 lbs)
PCB Carrier/Fixing: Belt/Pneumatic
Clearance
Top: 25 mm (0.98 in)
Bottom: 40 mm (1.58 in)
Edge: 3 mm (0.12 in)
Dimensions
Dimensions (W x D x H): 1000 x 1400 x 1647 mm (39.4 x 55.1 x 64.8 in) (not including signal tower, height: 520 mm)
Weight: 675 kg (1489 lbs)
Power Requirement: 200 - 240 V, single phase, 50/60 Hz, 3 kVA
Air Requirement: 0.6 MPa (87 psi)
