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TDK B82498F3561G000 Inductor Chip Molded Wirewound 560nH 2% 25MHz 23Q-Factor Ceramic 230mA 1.3Ohm DCR 0805 Automotive Blister T/R

Name: TDK B82498F3561G000 Inductor Chip Molded Wirewound 560nH 2% 25MHz 23Q-Factor Ceramic 230mA 1.3Ohm DCR 0805 Automotive Blister T/R
Brand: TDK

ManufacturerTDK(View more products from this manufacturer)

ModelB82498F3561G000

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Size: 2.30X1.70mm

Type: Wirewound

Height: 1.4mm

Shield: シールドなし

Q-value: 23@50MHz

Materials: Ceramic

Inductance: 560nH

Mounting Type: Surface mount

Rated current: 230mA

Inductance tolerance: 2%

Self-Resonant Frequency: 400MHz

Direct-current resistance: 1.3Ohm max

Inductance Frequency -Test: 25MHz

Operating temperature range: -55 to 125C

Datasheet