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Placement accuracy: ±15um@3σ
Placement angle accuracy: ±0.3°@3σ
Force control range: 20-1000g(with different configurations,the maximum support is 7500g)
Force control accuracy: 20g-150g:±2g; 150g-1000g:±5%
Silicon wafer processing(mm): Max 12""(300mm), compatible with 8""(150mm)
Die size(mm): 0.25*0.25mm-10*10mm
Loading/Unloading: Manual/auto
Applicable material box(mm): L：110-310 W：20-110 H：70-153
Applicable lead frame(mm): L：100-300 W：38-100 H：0.1-0.8
Glue feeding mode: Dispensing+painting glue
Core module movement mode: Linear motor + grating scale
Bottom photo-taking: Option
Machine dimension(L×W×H): 2480mm×1470mm×1700mm
Weight: Approx.1800kg
*Remarks: Customization is supported
