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- General technical data:
Overall dimension(mm) (Not include the keyboard, indicator light and monitor): 1435(L)*1800(W)*1670(H)
Equipment Weight(kg): Approx.1050
Max PCB size(mm): 510(L)x450(W)
Min PCB size(mm): 120(L)x50(W)
PCB Top Side Clearance (mm): 120
PCB Bottom Side Clearance (mm): 60
PCB process edge (mm): ≥3
Conveyor Height From Floor (mm): 900±20
PCB Conveying Speed (mm/s): 0.2-10
Max PCB Weight (kg): ≤5
PCB Thickness With Jig (mm): 1-6
Conveyor Width Adjustment Range (mm): 50-450
Conveyor Width Adjustment Mode: Electric
PCB Conveying Direction: Left to right
Air Input Pressure (Mpa): 0.6
Nitrogen Supply: Offered by customer
Nitrogen Input Pressure (Mpa): 0.6
Nitrogen Consumption (m³/h): 1.5
Required Purity of Nitrogen (%): ≥99.999
Supply Voltage (VAC): 380
Voltage Tolerance Range(%): 6-10
Frequency (HZ): 50/60
Max Power Consumption (kw): <11
Max Current (A): <20
Ambient Temperature (℃): 10-35
Machine Noise Leve (dB): <65
Communication Interface: SMEMA
Soldering System
Max.Soldering distance of Xaxis(mm): 510
Max.Soldering distance of Y axis(mm): 450
Max.Soldering distance of Z axis(mm): 60
Nozzle outer diameter(mm): 5、6、8、9、10、12、14
Nozzle inner diameter (mm): 2.4、3、4、5、6、8、10
Max soldering wave height(mm): 5
Solder pot capacity (kg)
Approx.13kg(Sn63Pb)/solder pot
Approx.12kg(lead-free)/solder pot
Max soldering temperature(℃): 330
Soldering heating power (kw): 1.15
Preheating System
Preheat temperature range(℃): <200
Heating power (kw): 5
Heating mode: Hot air
