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Pitch: 0.8 mm (0.031 in)
Data Rate: 8 Gb/s
Stack Height: 6 mm
Current Rating: 2.9 A
Mounting Angle: Straight
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Voltage Rating: 235 VAC, 330 VDC
Contact Plating: Gold
Contact Material: Beryllium Copper
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 8 Gbps
Termination Style: Solder
Number of Positions: 60 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
