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Motion System:
Z accuracy: ±100 μm (0.004 in.)
Z repeatability: ±50 μm (0.002 in.), 3 sigma
Z velocity: 0.05 m/s peak (2 in./s)
X-Y accuracy: ±100 μm (0.004 in.)
X-Y repeatability: ±50 μm (0.002 in.), 3 sigma
X-Y velocity: 0.2 m/s peak (8 in./s)
Computer:
PC with Windows® operating system
Windows is a registered trademark of Microsoft Corporation in the United States and other countries.
Software: PhotoScan “point-and-click” programming editor and machine control software
Solder Pot Capacity and Weight:
Capacity: Approx. 12.0 kg (26.4 lbs.)
Total weight of tin-lead solder, solder pot, and pump assembly: Approx. 22.4 kg (49.2 lbs.)
Total weight of lead-free solder, solder pot, and pump assembly: Approx. 19.7 kg (43.3 lbs.)
Max. temperature: 320°C
Preheating:
Selectable topside preheating from 1.5 to 18 KW
Selectable bottom preheating from 1.5 to 8 KW
Solderable Area (X-Y): Single, parallel or double operating mode:
508.1 S: Max. 508 x 508 mm (20.0 x 20.0 in.)
508.1 Two-Segment: Max. 700 x 508 mm (27.6 x 20.0 in.)
Board Handling Capability:
508.4 Two-Segment
Max. board size: 700 x 508 mm (27.6 x 20.0 in.)
Max. board size (2x boards): 350 x 508 mm (13.8 x 20.0 in.)
Min. board size: 50 x 50 mm (2.0 x 2.0 in.)
Conveyor:
Max. board/carrier length: 508 mm (20.0 in.), Two-Segment up to 700 mm (27.6 x 20.0 in.)
Min. board/carrier length: 50 mm (2.0 in.)
Max. board/carrier width: 508 mm (20.0 in.)
Min. board/carrier width: 50 mm (2.0 in.)
Max. board/carrier thickness: 15.2 mm (0.6 in.)
Max. overboard clearance: 120 mm (4.7 in.)
Max. underboard clearance: 40 mm (1.5 in.)
Edge clearance: 3 mm (0.12 in.), edge conveyor including on-rail clamps
Transport height: Conforms to SMEMA standard for conveyor height; height adjustable from 940-965 mm (37.0 -38.0 in.) from the floor to bottom of the board.
Load capacity: 7.5 kg (16.5 lbs.)
Operation modes: Automatic (SMEMA), manual or pass-through
