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Pitch: 0.35 mm (0.014 in)
Application: Hybrid FPC-to-Board
Stack Height: 0.6 mm
Current Rating: 300 mA, 2.5 A
Mounting Angle: Straight
Number of Rows: 2 Row
Voltage Rating: 30 VAC, 30 VDC
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 20 Position
Insulation Resistance: 50 MOhms
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
