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Microbond SMT701: Low Silver Alloy Solder Paste
Excellent wetting in air
reflow, a wide process window and a low silver content make Microbond SMT701
the first choice for SMT applications.
Microbond SMT701 solder paste is a state-of-the-art lead-free
no-clean solder paste that promotes good wetting and minimizes soldering
defects. It is designed especially for SMT applications in consumer,
communication, computing and LED assembly segment.
The FC701 flux system is specifically optimized for
lead-free alloys, e.g. Sn/Ag/Cu. This formula provides superior performance on
OSP surfaces finishes and leaves behind a clear residue.
Key benefits of Microbond SMT701
Wide process window
Good wetting on OSP, HASL surface and Al board
Good void performance
Transparent residue
Low voiding in solder joint
Improve BGA head-in-pillow defect
