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Measurement and computation of material parameters according to DIN EN ISO 14577-1 Annex A and ASTM E 2546
Determination of numerous plastic and elastic properties such as Vickers hardness, modulus of indentation and creep
Dynamic measurement mode (dynamic mechanical analysis)
Suitable for testing solid materials and coatings in the nanometer range, test-force range 0.005 – 500 mN
Modular design allows for easy adaption to your needs
Zero point determined in less than a minute, enabling quick measurements
Programmable XY stage with positioning accuracy of 0.5µm makes measuring on small areas like bond wires possible
Samples up to 13 cm tall can be measured
High-quality scientific microscope
Thermally stable: measures at constant temperatures for several hours
Powerful WIN-HCU software for intuitive operation and evaluation
Indenters: Vickers, Berkovich or carbide ball, as well as special indenters on request
Applications
Measurements on extremely small test areas, e.g. bond pads in the semiconductor industry
Analysis of ion-implanted surfaces
Testing of nano layers with sensors
Measurements on biological materials
Dynamic-mechanical analysis of small samples
Measurement of the hardness and elasticity of PVD, CVD coatings like DLC (diamond-like carbon), as well as chemical nickel layers
Automated measurements on multiple samples
Determination of the mechanical properties of structural components in materialography
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