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Type: DIP|ZIF(ZIP)(7.62mm)Line Spacing
Pitch: 2.54mm
Feature: Closed Frame
Terminal: Solder
Dielectric: Polyphenylene Sulfide(PPS)|Glass Filling
Mounting Type: Through Hole
Number of positions: 40(2x20)
Contact point finish: Gold
Contact(Post) Finish: Gold
Contact Material (Post): Beryllium Copper
Contact Finish Thickness: 0.25um
Contact Material (Fitting): Beryllium Copper
