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Pitch: 0.5 mm (0.02 in)
Application: Board to Board
Stack Height: 3 mm
Current Rating: 500 mA
Mounting Angle: Vertical
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Thermoplastic (TP)
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 30 Position
Insulation Resistance: 500 MOhms
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
