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Pitch: 1.27 mm (0.05 in)
Application: Wire-to-Wire
Row Spacing: 2.54 mm (0.1 in)
Unit Weight: 1.141 g
Mounting Style: Through Hole
Number of Rows: 4 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Termination Style: Solder Pin
Number of Positions: 26 Position
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 65 C
